发明授权
- 专利标题: Thermoformed EMI shield
- 专利标题(中): 热成型EMI屏蔽
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申请号: US12394884申请日: 2009-02-27
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公开(公告)号: US07928326B2公开(公告)日: 2011-04-19
- 发明人: Mark S Tracy , Jeffrey A Lev , Paul N Walker
- 申请人: Mark S Tracy , Jeffrey A Lev , Paul N Walker
- 申请人地址: US TX Houston
- 专利权人: Hewlett-Packard Development Company, L.P.
- 当前专利权人: Hewlett-Packard Development Company, L.P.
- 当前专利权人地址: US TX Houston
- 代理商 Michael S. Czarnecki
- 主分类号: H05K9/00
- IPC分类号: H05K9/00
摘要:
Systems and methods for minimizing the transmission and reception of electromagnetic interference (“EMI”) are provided. A member having first and second sides and at least one edge can be formed to correspond to the interior of an enclosure. At least one aperture can penetrate the member from the first side to the second side, forming at least one internal edge. A conductive layer can be disposed on or about the first side, the second side, the at least one edge, and the at least one internal edge of the member, thereby encapsulating the member.
公开/授权文献
- US20100218987A1 THERMOFORMED EMI SHIELD 公开/授权日:2010-09-02