发明授权
- 专利标题： Integrated circuit package system
- 专利标题（中）： 集成电路封装系统
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申请号： US11558589申请日： 2006-11-10
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公开(公告)号： US07928540B2公开(公告)日： 2011-04-19
- 发明人: Il Kwon Shim , Antonio B. Dimaano, Jr. , Henry D. Bathan , Jeffrey D. Punzalan
- 申请人： Il Kwon Shim , Antonio B. Dimaano, Jr. , Henry D. Bathan , Jeffrey D. Punzalan
- 申请人地址： SG Singapore
- 专利权人： STATS ChipPAC Ltd.
- 当前专利权人： STATS ChipPAC Ltd.
- 当前专利权人地址： SG Singapore
- 代理商 Mikio Ishimaru
- 主分类号： H01L21/56
- IPC分类号： H01L21/56 ; H01L23/495
摘要：
An integrated circuit package system is provided including forming an external interconnect having a lead body and a lead tip, forming a lead protrusion in the lead tip, connecting a device and the external interconnect, and encapsulating the device and the external interconnect.
公开/授权文献
- US20080111215A1 INTEGRATED CIRCUIT PACKAGE SYSTEM 公开/授权日：2008-05-15