发明授权
- 专利标题： Semiconductor device, electronic component module, and method for manufacturing semiconductor device
- 专利标题（中）： 半导体装置，电子部件模块以及半导体装置的制造方法
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申请号： US12277360申请日： 2008-11-25
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公开(公告)号： US07928559B2公开(公告)日： 2011-04-19
- 发明人: Hideo Nakagoshi
- 申请人： Hideo Nakagoshi
- 申请人地址： JP Kyoto
- 专利权人： Murata Manufacturing Co., Ltd.
- 当前专利权人： Murata Manufacturing Co., Ltd.
- 当前专利权人地址： JP Kyoto
- 代理机构： Keating & Bennett, LLP
- 优先权： JP2006-146120 20060526
- 主分类号： H01L23/10
- IPC分类号： H01L23/10 ; H01L23/34
摘要：
A semiconductor element is provided with a heat dissipating path defined by a non-through hole in a first principal surface and that is filled with a conductive material. The semiconductor element is bonded to a heat sink with the conductive material disposed therebetween. Solder can be used as the conductive material, for example. By introducing molten solder into the non-through hole while having solder disposed between the semiconductor element and the heat sink, the heat dissipating path is provided and the heat sink is bonded to the semiconductor element.
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