Invention Grant
- Patent Title: Circuit board for inkjet head
- Patent Title (中): 喷墨头电路板
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Application No.: US11472523Application Date: 2006-06-22
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Publication No.: US07931354B2Publication Date: 2011-04-26
- Inventor: Koji Imai
- Applicant: Koji Imai
- Applicant Address: JP Nagoya-shi, Aichi-ken
- Assignee: Brother Kogyo Kabushiki Kaisha
- Current Assignee: Brother Kogyo Kabushiki Kaisha
- Current Assignee Address: JP Nagoya-shi, Aichi-ken
- Agency: Baker Botts L.L.P.
- Priority: JP2005-183413 20050623
- Main IPC: B41J2/14
- IPC: B41J2/14
Abstract:
Second individual electrodes are formed and arranged in zigzag in two rows on one surface of a flexible sheet, and wirings connected to the second individual electrodes are arranged to pass between adjacent second individual electrodes of the other row. Formed on the other surface of the flexible sheet are electrode connection sections to be connected to the second individual electrodes through through-holes going through the flexible sheet. The electrode connection section has an area larger than the second individual electrode and is connected to an external electrode through solder.
Public/Granted literature
- US20060290742A1 Circuit board and inkjet head Public/Granted day:2006-12-28
Information query
IPC分类:
