发明授权
US07932169B2 Interconnection for flip-chip using lead-free solders and having improved reaction barrier layers
有权
使用无铅焊料进行倒装芯片的互连并具有改进的反应阻挡层
- 专利标题： Interconnection for flip-chip using lead-free solders and having improved reaction barrier layers
- 专利标题（中）： 使用无铅焊料进行倒装芯片的互连并具有改进的反应阻挡层
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申请号： US12587301申请日： 2009-10-05
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公开(公告)号： US07932169B2公开(公告)日： 2011-04-26
- 发明人: Luc Belanger , Stephen L. Buchwalter , Leena Paivikki Buchwalter , Ajay P. Giri , Jonathan H. Griffith , Donald W. Henderson , Sung Kwon Kang , Eric H. Laine , Christian Lavoie , Paul A. Lauro , Valérie Anne Oberson , Da-Yuan Shih , Kamalesh K Srivastava , Michael J. Sullivan
- 申请人： Luc Belanger , Stephen L. Buchwalter , Leena Paivikki Buchwalter , Ajay P. Giri , Jonathan H. Griffith , Donald W. Henderson , Sung Kwon Kang , Eric H. Laine , Christian Lavoie , Paul A. Lauro , Valérie Anne Oberson , Da-Yuan Shih , Kamalesh K Srivastava , Michael J. Sullivan
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理商 Thomas A. Beck; Daniel P. Morris
- 主分类号： H01L21/44
- IPC分类号： H01L21/44
摘要：
An interconnection structure suitable for flip-chip attachment of microelectronic device chips to packages, comprising a two, three or four layer ball-limiting metallurgy including an adhesion/reaction barrier layer, and having a solder wettable layer reactive with components of a tin-containing lead free solder, so that the solderable layer can be totally consumed during soldering, but a barrier layer remains after being placed in contact with the lead free solder during soldering. One or more lead-free solder balls is selectively situated on the solder wetting layer, the lead-free solder balls comprising tin as a predominant component and one or more alloying components.
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