Invention Grant
US07933476B2 Method and device for providing electronic circuitry on a backplate
有权
用于在背板上提供电子电路的方法和装置
- Patent Title: Method and device for providing electronic circuitry on a backplate
- Patent Title (中): 用于在背板上提供电子电路的方法和装置
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Application No.: US12710135Application Date: 2010-02-22
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Publication No.: US07933476B2Publication Date: 2011-04-26
- Inventor: Karen Tyger
- Applicant: Karen Tyger
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM MEMS Technologies, Inc.
- Current Assignee: QUALCOMM MEMS Technologies, Inc.
- Current Assignee Address: US CA San Diego
- Agency: Knobbe Martens Olson & Bear LLP
- Main IPC: G02B6/26
- IPC: G02B6/26
Abstract:
A MEMS-based display device is described, wherein an array of interferometric modulators are configured to reflect light through a transparent substrate. The transparent substrate is sealed to a backplate and the backplate may contain electronic circuitry fabricated on the backplane. The electronic circuitry is placed in electrical communication with the array of interferometric modulators and is configured to control the state of the array of interferometric modulators.
Public/Granted literature
- US20100144230A1 METHOD AND DEVICE FOR PROVIDING ELECTRONIC CIRCUITRY ON A BACKPLATE Public/Granted day:2010-06-10
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