Invention Grant
- Patent Title: Data transfer between devices within an integrated circuit
- Patent Title (中): 集成电路内的器件之间的数据传输
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Application No.: US12320718Application Date: 2009-02-03
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Publication No.: US07934029B2Publication Date: 2011-04-26
- Inventor: Nicolas Chaussade
- Applicant: Nicolas Chaussade
- Applicant Address: GB Cambridge
- Assignee: ARM Limited
- Current Assignee: ARM Limited
- Current Assignee Address: GB Cambridge
- Agency: Nixon & Vanderhye P.C.
- Priority: GB0803013.2 20080219
- Main IPC: G06F13/12
- IPC: G06F13/12 ; H03M7/38

Abstract:
An integrated circuit 2 is provided including multiple devices 4, 6, 8, 10, 12, 14 for communicating via an interconnect 16. A sending device 18 includes a sideband signal indicating the use of a representation of a repeating data word in place of that repeating data word itself. The receiving device can then form the repeating pattern of data words in response to receipt of the representation. This reduces the bandwidth consumed upon the interconnect 16.
Public/Granted literature
- US20090210595A1 Data transfer between devices within an integrated circuit Public/Granted day:2009-08-20
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