Invention Grant
- Patent Title: Heat-activatedly bondable 2D element
- Patent Title (中): 热激结合的2D元件
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Application No.: US11619835Application Date: 2007-01-04
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Publication No.: US07935215B2Publication Date: 2011-05-03
- Inventor: Marc Husemann , Matthias Koop , Frank Hannemann
- Applicant: Marc Husemann , Matthias Koop , Frank Hannemann
- Applicant Address: DE Hamburg
- Assignee: tesa SE
- Current Assignee: tesa SE
- Current Assignee Address: DE Hamburg
- Agency: Norris McLaughlin & Marcus PA
- Priority: DE102006055093 20061121
- Main IPC: C09J5/02
- IPC: C09J5/02 ; C04B37/00 ; B32B7/12 ; B32B15/04

Abstract:
Presented is a heat-activatedly bondable 2D element having a first adhesive and a second adhesive, which is suitable for bonding objects with a metal surface to objects with a plastic surface, and which enables a stable and mechanically robust bond even at low temperatures. This is achieved through the use of particular combinations of different adhesives, tailored to one another and based on synthetic nitrile rubbers and reactive resins.
Public/Granted literature
- US20080115888A1 HEAT-ACTIVATEDLY BONDABLE 2D ELEMENT Public/Granted day:2008-05-22
Information query
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