发明授权
US07939350B2 Method for encapsulating a substrate and method for fabricating a light emitting diode device
失效
用于封装衬底的方法和用于制造发光二极管器件的方法
- 专利标题： Method for encapsulating a substrate and method for fabricating a light emitting diode device
- 专利标题（中）： 用于封装衬底的方法和用于制造发光二极管器件的方法
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申请号： US12341037申请日： 2008-12-22
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公开(公告)号： US07939350B2公开(公告)日： 2011-05-10
- 发明人: Bin-Hong Tsai
- 申请人： Bin-Hong Tsai
- 申请人地址： US DE Wilmington
- 专利权人： E. I. du Pont de Nemours and Company
- 当前专利权人： E. I. du Pont de Nemours and Company
- 当前专利权人地址： US DE Wilmington
- 代理商 Konrad H. Kaeding
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
The present invention relates to a method for encapsulating a substrate, which comprises: (a1) providing a substrate with a plurality of chips mounted on a top of the substrate; (b1) compressing a dry film photoresist on the top side of the substrate to form a photoresist layer; (c1) exposing the photoresist layer to a light source through a mask to form unexposed photoresist regions and exposed photoresist regions; (d1) developing the photoresist layer to uncover underlying portions of the unexposed photoresist regions; (e1) molding the top side of the substrate with a molding material; (f1) curing the molding material; and (g1) removing the unexposed photoresist regions from the substrate with a photoresist-removing agent.
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