Invention Grant
US07939842B2 Light emitting device packages, light emitting diode (LED) packages and related methods
有权
发光器件封装，发光二极管（LED）封装及相关方法
- Patent Title: Light emitting device packages, light emitting diode (LED) packages and related methods
- Patent Title (中): 发光器件封装，发光二极管（LED）封装及相关方法
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Application No.: US11895795Application Date: 2007-08-27
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Publication No.: US07939842B2Publication Date: 2011-05-10
- Inventor: Ban P. Loh , Peter Scott Andrews , Nicholas W. Medendorp, Jr.
- Applicant: Ban P. Loh , Peter Scott Andrews , Nicholas W. Medendorp, Jr.
- Applicant Address: US NC Durham
- Assignee: Cree, Inc.
- Current Assignee: Cree, Inc.
- Current Assignee Address: US NC Durham
- Agency: Jenkins, Wilson, Taylor & Hunt, P.A.
- Main IPC: H01L29/267
- IPC: H01L29/267 ; H01L21/00 ; F21V9/16 ; H01J5/48
Abstract:
Light emitting device packages, light emitting diode (LED) packages and related methods are disclosed. According to one aspect, a light emitting device package is provided. The package includes a mounting pad adapted for attachment of a light emitting device. A lens coupler is attached to the mounting pad and defines an opening for containing the light emitting device and a quantity of encapsulant. The lens coupler includes a surface defining a depression which comprises at least one edge that shapes an outer surface of the encapsulant.
Public/Granted literature
- US20080054286A1 Light emitting device packages, light emitting diode (LED) packages and related methods Public/Granted day:2008-03-06
Information query
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