发明授权
- 专利标题： Circuit board for LED
- 专利标题（中）： LED电路板
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申请号： US12404350申请日： 2009-03-16
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公开(公告)号： US07939846B2公开(公告)日： 2011-05-10
- 发明人: Chin-Ching Chen , Cheng-Yi Chang , Ming-Kuei Lin
- 申请人： Chin-Ching Chen , Cheng-Yi Chang , Ming-Kuei Lin
- 申请人地址： TW Tucheng, Taipei Hsien
- 专利权人： Everlight Electronics Co., Ltd.
- 当前专利权人： Everlight Electronics Co., Ltd.
- 当前专利权人地址： TW Tucheng, Taipei Hsien
- 代理商 Winston Hsu; Scott Margo
- 优先权： TW97144357A 20081117
- 主分类号： H01L33/00
- IPC分类号： H01L33/00
摘要：
An LED is bonded to a circuit board. The circuit board comprises a chip mounting area, a bonding pad, and a connecting portion. The LED is mounted on the chip mounting area with an adhesive, and the bonding pad is connected with an electrode of the LED. Moreover, the connecting portion is positioned between the chip mounting area and the bonding pad. One side of the connecting portion is connected with the chip mounting area and another side is connected with the bonding pad. With a hollow portion of the connecting portion, the adhesive will be prevented from flowing to the bonding pad.
公开/授权文献
- US20100123157A1 CIRCUIT BOARD FOR LED 公开/授权日：2010-05-20
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