Invention Grant
- Patent Title: Mounting substrate and electronic apparatus
- Patent Title (中): 安装基板和电子设备
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Application No.: US12526242Application Date: 2008-01-29
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Publication No.: US07939951B2Publication Date: 2011-05-10
- Inventor: Hirotoshi Usui
- Applicant: Hirotoshi Usui
- Applicant Address: JP Kyoto
- Assignee: Rohm Co., Ltd.
- Current Assignee: Rohm Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Rabin & Berdo, PC
- Priority: JP2007-027953 20070207
- International Application: PCT/JP2008/051250 WO 20080129
- International Announcement: WO2008/096633 WO 20080814
- Main IPC: H01L21/31
- IPC: H01L21/31 ; H01L21/469
Abstract:
A mounting substrate having a structure allowing reduction of the cost and an electronic apparatus formed by surface-mounting a semiconductor device thereon are provided. The mounting substrate is a mounting substrate mounted with a semiconductor device having external terminals alignedly arrayed in the form of a matrix, and includes junctions arrayed on a surface to which the semiconductor device is opposed so that the external terminals are bonded thereto respectively and wires connected to the junctions respectively and extracted out of a region to which the semiconductor device is bonded. The wires connected to inwardly arrayed 4 rows by n columns (n: integer of not less than 5) of the junctions respectively are formed on a first wiring layer. The wires connected to the junctions set in two annular arrays surrounding the outer sides of the 4 rows by n columns of junctions respectively are formed on a second wiring layer different from the first wiring layer.
Public/Granted literature
- US20100314770A1 Mounting Substrate and Electronic Apparatus Public/Granted day:2010-12-16
Information query
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