Invention Grant
- Patent Title: Packaging structure for building boards and building boards loading structure
- Patent Title (中): 建筑板和建筑板装载结构的包装结构
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Application No.: US12003617Application Date: 2007-12-28
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Publication No.: US07942262B2Publication Date: 2011-05-17
- Inventor: Masaru Watanabe , Yoshinori Hibino
- Applicant: Masaru Watanabe , Yoshinori Hibino
- Applicant Address: JP Nagoya-shi
- Assignee: Nichiha Corporation
- Current Assignee: Nichiha Corporation
- Current Assignee Address: JP Nagoya-shi
- Agency: Kratz, Quintos & Hanson, LLP
- Priority: JP2007-000091 20070112; JP2007-001844 20070320
- Main IPC: B65D85/46
- IPC: B65D85/46 ; B65D19/00 ; B65D71/00 ; B65D85/00

Abstract:
A building boards loading structure which loads plural building boards, being similar sheets, on a pallet. The building boards loading structure has plural packages, and the packages have plural building boards and plural bands. The plural building boards are banded at plural locations by the plural bands, and the plural packages are stacked vertically, to provide an upper and lower package in regard to two packages, and loaded on a pallet. The locations of bands in each upper and lower package which is loaded on the pallet are different from each other in relation to the lateral direction. The location of bands in a lowest package which is loaded on the pallet is different, in relation to the lateral direction, from the location of the stringers and an entry in the pallet for inserting a fork of a fork lift truck.
Public/Granted literature
- US20080210139A1 PACKAGING STRUCTURE FOR BUILDING BOARDS AND BUILDING BOARDS LOADING STRUCTURE Public/Granted day:2008-09-04
Information query
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