发明授权
- 专利标题： Soldering apparatus
- 专利标题（中）： 焊接设备
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申请号： US12822309申请日： 2010-06-24
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公开(公告)号： US07942305B1公开(公告)日： 2011-05-17
- 发明人: Shen-Chun Li , Shou-Kuo Hsu , Yung-Chieh Chen , Hsien-Chuan Liang
- 申请人： Shen-Chun Li , Shou-Kuo Hsu , Yung-Chieh Chen , Hsien-Chuan Liang
- 申请人地址： TW Tu-Cheng, New Taipei
- 专利权人： Hon Hai Precision Industry Co., Ltd.
- 当前专利权人： Hon Hai Precision Industry Co., Ltd.
- 当前专利权人地址： TW Tu-Cheng, New Taipei
- 代理商 Clifford O. Chi
- 优先权： TW099107733 20100317
- 主分类号： B23K37/00
- IPC分类号： B23K37/00 ; B23K37/04 ; B23K3/02
摘要：
A soldering apparatus includes a base body, an actuator connected to the base body, and a pair of soldering arms connected to the actuator, each of the pair of soldering arms including a heating member and a soldering tip thermally coupled to the heating member. The pair of soldering arms is moveable and the actuator is controllable to move one soldering arm relative to the other soldering arm.
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