Invention Grant
- Patent Title: Connector assemblies
- Patent Title (中): 连接器组件
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Application No.: US12869319Application Date: 2010-08-26
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Publication No.: US07942678B2Publication Date: 2011-05-17
- Inventor: Emery A. Sanford , M. Evans Hankey , Christopher D. Prest , Way Chet Lim , Toshihiko Kato
- Applicant: Emery A. Sanford , M. Evans Hankey , Christopher D. Prest , Way Chet Lim , Toshihiko Kato
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Kramer Levin Naftalis & Frankel LLP
- Main IPC: H01R12/00
- IPC: H01R12/00

Abstract:
A headset connector assembly that includes a connector plate, a casing, and electrical contact members is provided. The connector plate can have a first mating surface, a second mating surface, and at least two apertures existing between the first and the second mating surfaces. The casing can have a first side in contact with the first mating surface and a second side. The casing can include a protruding cavity member for each of the at least two apertures. Each protruding cavity member can extend from the first side and be constructed to fit within one of the at least two apertures. Each protruding cavity member can house an electrical contact member.
Public/Granted literature
- US20110028041A1 CONNECTOR ASSEMBLIES Public/Granted day:2011-02-03
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