Invention Grant
- Patent Title: Anode used for electroplating
- Patent Title (中): 阳极用于电镀
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Application No.: US10540232Application Date: 2003-12-23
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Publication No.: US07943032B2Publication Date: 2011-05-17
- Inventor: Jorg Wurm , Stephane Menard
- Applicant: Jorg Wurm , Stephane Menard
- Applicant Address: DE FR
- Assignee: Metakem Gesellschaft fur Schichtchemie der Metalle mbH,M.P.C. Micropulse Plating Concepts
- Current Assignee: Metakem Gesellschaft fur Schichtchemie der Metalle mbH,M.P.C. Micropulse Plating Concepts
- Current Assignee Address: DE FR
- Agency: Swanson & Bratschun, L.L.C.
- Priority: DE10261493 20021223
- International Application: PCT/EP03/14785 WO 20031223
- International Announcement: WO2004/059045 WO 20040715
- Main IPC: C25D17/12
- IPC: C25D17/12 ; C25D5/00
Abstract:
The present invention relates to an anode for electroplating, which has an anode base and a shield and is characterized in that additive degradation is reduced when it is used in electroplating.
Public/Granted literature
- US20060124454A1 Anode used for electroplating Public/Granted day:2006-06-15
Information query
