Invention Grant
- Patent Title: Printed circuit board having electromagnetic bandgap structure
- Patent Title (中): 具有电磁带隙结构的印刷电路板
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Application No.: US12213291Application Date: 2008-06-17
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Publication No.: US07943864B2Publication Date: 2011-05-17
- Inventor: Han Kim , Hak-Sun Kim , Chang-Sup Ryu
- Applicant: Han Kim , Hak-Sun Kim , Chang-Sup Ryu
- Applicant Address: KR Suwon
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon
- Priority: KR10-2007-0061833 20070622
- Main IPC: H05K1/11
- IPC: H05K1/11

Abstract:
In accordance with an embodiment, the printed circuit board, having an analog circuit and a digital circuit includes: a first metal layer and a second metal layer, one of the first metal layer and the second metal layer being a power layer and the other being a ground layer; a third metal layer, layer-built between the first metal layer and the second metal layer; and a mushroom type structure including a via connected to a metal plate, the metal plate being arranged in a space between circuit patterns of the third metal layer.
Public/Granted literature
- US20080314635A1 Printed circuit board having electromagnetic bandgap structure Public/Granted day:2008-12-25
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