发明授权
- 专利标题： Thin package system with external terminals
- 专利标题（中）： 带外部端子的薄封装系统
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申请号： US11163558申请日： 2005-10-22
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公开(公告)号： US07947535B2公开(公告)日： 2011-05-24
- 发明人: Youngcheol Kim , Myung Kil Lee , Gwang Kim , Koo Hong Lee
- 申请人： Youngcheol Kim , Myung Kil Lee , Gwang Kim , Koo Hong Lee
- 申请人地址： SG Singapore
- 专利权人： STATS ChipPAC Ltd.
- 当前专利权人： STATS ChipPAC Ltd.
- 当前专利权人地址： SG Singapore
- 代理商 Mikio Ishimaru
- 主分类号： H01L21/56
- IPC分类号： H01L21/56
摘要：
A thin package system with external terminals and a leadframe is provided. An external bond finger defining template is provided and used to form external bond fingers on the leadframe. A die is provided and attached to the leadframe. At least portions of the die and the external bond fingers are encapsulated, and the leadframe is removed.
公开/授权文献
- US20070090495A1 THIN PACKAGE SYSTEM WITH EXTERNAL TERMINALS 公开/授权日：2007-04-26
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