发明授权
- 专利标题： Substrate for semiconductor device, resin-sealed semiconductor device, method for manufacturing said substrate for semiconductor device and method for manufacturing said resin-sealed semiconductor device
- 专利标题（中）： 半导体装置用基板，树脂密封型半导体装置，半导体装置用基板的制造方法及树脂密封型半导体装置的制造方法
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申请号： US12923569申请日： 2010-09-28
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公开(公告)号： US07947598B2公开(公告)日： 2011-05-24
- 发明人: Chikao Ikenaga , Shozo Ishikawa
- 申请人： Chikao Ikenaga , Shozo Ishikawa
- 申请人地址： JP Toyota
- 专利权人： Dai Nippon Printing Co., Ltd.
- 当前专利权人： Dai Nippon Printing Co., Ltd.
- 当前专利权人地址： JP Toyota
- 代理机构： Oliff & Berridge, PLC
- 优先权： JP2007-319685 20071211
- 主分类号： H01L21/44
- IPC分类号： H01L21/44 ; H01L23/48
摘要：
A substrate for a semiconductor device includes: a base plate, a plurality of external terminal portions respectively arranged in a plane on the base plate and having external terminal faces respectively facing the base plate; a plurality of internal terminal portions, respectively arranged in the plane on the base plate and having internal terminal faces respectively facing an opposite side to the base plate. The internal terminal portions are connected with the external terminal portions via wiring portions, respectively. A part of the external terminal portions are located on the base plate in a predetermined arrangement area in which a semiconductor element is arranged.
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