Invention Grant
- Patent Title: Keypad assembly
- Patent Title (中): 键盘装配
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Application No.: US12041718Application Date: 2008-03-04
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Publication No.: US07947915B2Publication Date: 2011-05-24
- Inventor: Yu-Sheop Lee , Sun-Tae Jung , Joo-Hoon Lee
- Applicant: Yu-Sheop Lee , Sun-Tae Jung , Joo-Hoon Lee
- Applicant Address: KR Maetan-Dong, Yeongtong-Gu, Suwon-Si, Gyeonggi-Do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Maetan-Dong, Yeongtong-Gu, Suwon-Si, Gyeonggi-Do
- Agency: Cha & Reiter, LLC
- Priority: KR10-2007-0031187 20070329
- Main IPC: H01H9/00
- IPC: H01H9/00

Abstract:
Disclosed is a keypad assembly including a light guide panel, light, at least one light extracting pattern provided on the light guide panel so that light propagating inside the light guide panel is directed out of the light guide panel, a switch board having at least one switch; and at least one light source for coupling light to the inside of the light guide panel, wherein the light guide panel has a thickness of 0.03-0.6 mm.
Public/Granted literature
- US20080237011A1 KEYPAD ASSEMBLY Public/Granted day:2008-10-02
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