- 专利标题: Semiconductor memory device and method of fabricating the same
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申请号: US12108101申请日: 2008-04-23
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公开(公告)号: US07948021B2公开(公告)日: 2011-05-24
- 发明人: Hideaki Maekawa
- 申请人: Hideaki Maekawa
- 申请人地址: JP Tokyo
- 专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人地址: JP Tokyo
- 代理机构: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- 优先权: JP2007-120067 20070427
- 主分类号: H01L29/788
- IPC分类号: H01L29/788
摘要:
A semiconductor memory includes a memory cell array area provided with first and second memory cells and having a first active area and a first element isolation area constituting a line & space structure, and having a floating gate electrode and a control gate electrode in the first active area, a word line contact area adjacent to the memory cell array area and having a second active area, first and second word lines with a metal silicide structure, functioning respectively as the control gate electrodes of the first and second memory cells and arranged to straddle the memory cell array area and the word line contact area. A dummy gate electrode is arranged just below the first and second word lines in the second active area.
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