发明授权
- 专利标题： Integrated circuit package system with lead locking structure
- 专利标题（中）： 具有引线锁定结构的集成电路封装系统
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申请号： US11964501申请日： 2007-12-26
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公开(公告)号： US07948066B2公开(公告)日： 2011-05-24
- 发明人: Byung Tai Do , Heap Hoe Kuan , Linda Pei Ee Chua
- 申请人： Byung Tai Do , Heap Hoe Kuan , Linda Pei Ee Chua
- 申请人地址： SG Singapore
- 专利权人： Stats Chippac Ltd.
- 当前专利权人： Stats Chippac Ltd.
- 当前专利权人地址： SG Singapore
- 代理商 Mikio Ishimaru
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L21/44
摘要：
A mountable integrated circuit package system includes: providing a base; depositing a photoresist on the base; patterning the photoresist with an opening; filling the opening with a metal; depositing a further metal on the metal to form a lead pad; removing the photoresist; attaching a die over the base; bonding wires between the die and the lead pad; encapsulating the die and the lead pad in an encapsulation formed into a lead pad lock adjacent the lead pad; and removing the base.