Surface mountable hermetically sealed package

Invention Grant

US07948069B2 Surface mountable hermetically sealed package 有权

Title translation: 表面贴装密封包装

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Patent Title: Surface mountable hermetically sealed package
Patent Title (中): 表面贴装密封包装
Application No.: US11044933

Application Date: 2005-01-27
Publication No.: US07948069B2

Publication Date: 2011-05-24
Inventor: Weidong Zhuang
Applicant: Weidong Zhuang
Applicant Address: US CA El Segundo
Assignee: International Rectifier Corporation
Current Assignee: International Rectifier Corporation
Current Assignee Address: US CA El Segundo
Agency: Farjami & Farjami LLP
Main IPC: H01L23/02
IPC: H01L23/02

Surface mountable hermetically sealed package

Abstract:

A high reliability package which includes electrical terminals formed from an alloy of tungsten copper and brazed onto a surface of a ceramic substrate.

Abstract(Chinese):

一种高可靠性封装，其包括由钨铜合金形成并钎焊在陶瓷基板的表面上的电端子。

Public/Granted literature

US20050167789A1 Surface mountable hermetically sealed package Public/Granted day:2005-08-04

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L23/00	半导体或其他固态器件的零部件（H01L25/00优先）
H01L23/02	.容器；封接（H01L23/12，H01L23/34，H01L23/48，H01L23/552优先）