发明授权
- 专利标题: Omnidirectional eddy current array probes and methods of use
- 专利标题(中): 全向涡流阵列探头和使用方法
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申请号: US12246637申请日: 2008-10-07
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公开(公告)号: US07948233B2公开(公告)日: 2011-05-24
- 发明人: Aparna Chakrapani Sheila-Vadde , Ui Won Suh , Changting Wang
- 申请人: Aparna Chakrapani Sheila-Vadde , Ui Won Suh , Changting Wang
- 申请人地址: US NY Niskayuna
- 专利权人: General Electric Company
- 当前专利权人: General Electric Company
- 当前专利权人地址: US NY Niskayuna
- 代理商 Penny A. Clarke
- 主分类号: G01N27/72
- IPC分类号: G01N27/72 ; G01N27/82 ; G01R33/12
摘要:
Omnidirectional eddy current array probes for detecting flaws in a conductive test object generally includes semi-circular wave shaped continuous drive lines in two rows disposed in two layers that are multiplexed for omnidirectional inspection without blind spots. The semicircular wave shaped continuous drive lines are superimposed to form pseudo-circular drive lines, wherein each row of drive lines is offset laterally by a distance preferably equal to a quarter wavelength of the wave pattern. For only parallel and perpendicular flaws, the drive multiplexing is not needed and each row will have only one set of drive lines. In alternate embodiments, there can be square-shaped, oval shaped, rectangular-shaped or other shaped wave patterns as well. Also disclosed are methods for sensing surface flaws and compensating their response.