Invention Grant
- Patent Title: Exposure apparatus and method for producing device
- Patent Title (中): 曝光装置及其制造方法
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Application No.: US11144827Application Date: 2005-06-06
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Publication No.: US07948604B2Publication Date: 2011-05-24
- Inventor: Soichi Owa
- Applicant: Soichi Owa
- Applicant Address: JP Tokyo
- Assignee: Nikon Corporation
- Current Assignee: Nikon Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2002-357961 20021210; JP2003-002820 20030109; JP2003-049367 20030226
- Main IPC: G03B27/52
- IPC: G03B27/52 ; G03B27/42

Abstract:
An exposure apparatus, wherein exposure is carried out while filling a space between a projection optical system and a substrate with a liquid, enables to suppress deterioration of a pattern image caused by any bubble in the liquid. The exposure apparatus includes a liquid supply unite 1 which fills at least a part of the space between the projection optical system and the substrate with a liquid 50, and exposes the substrate by projecting an image of a pattern onto the substrate via the projection optical system. The liquid supply unite 1 includes a degassing unit 21 which suppresses the generation of the bubble in the liquid 50.
Public/Granted literature
- US20050219490A1 Exposure apparatus and method for producing device Public/Granted day:2005-10-06
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