Invention Grant
- Patent Title: High throughput wafer notch aligner
- Patent Title (中): 高通量晶圆缺口对准器
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Application No.: US11634697Application Date: 2006-12-06
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Publication No.: US07949425B2Publication Date: 2011-05-24
- Inventor: Robert J. Mitchell , Joseph Ferrara
- Applicant: Robert J. Mitchell , Joseph Ferrara
- Applicant Address: US MA Beverly
- Assignee: Axcelis Technologies, Inc.
- Current Assignee: Axcelis Technologies, Inc.
- Current Assignee Address: US MA Beverly
- Agency: Eschweiler & Associates, LLC
- Main IPC: G07F7/00
- IPC: G07F7/00

Abstract:
An ion implantation apparatus, system, and method are provided for a transferring a plurality of workpieces between vacuum and atmospheric pressures, wherein an alignment mechanism is operable to align a plurality of workpieces for generally simultaneous transportation to a dual-workpiece load lock chamber. The alignment mechanism comprises a characterization device, an elevator, and two vertically-aligned workpiece supports for supporting two workpieces. First and second atmospheric robots are configured to generally simultaneously transfer two workpieces at a time between load lock modules, the alignment mechanism, and a FOUP. Third and fourth vacuum robots are configured to transfer one workpiece at a time between the load lock modules and a process module.
Public/Granted literature
- US20080138175A1 High throughput wafer notch aligner Public/Granted day:2008-06-12
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