发明授权
- 专利标题： Wafer grounding method for electrostatic clamps
- 专利标题（中）： 用于静电夹的晶圆接地方法
-
申请号： US12262399申请日： 2008-10-31
-
公开(公告)号： US07952851B2公开(公告)日： 2011-05-31
- 发明人: Marvin R. LaFontaine , Ari Eiriksson , Ashwin M. Purohit , William D. Lee
- 申请人： Marvin R. LaFontaine , Ari Eiriksson , Ashwin M. Purohit , William D. Lee
- 申请人地址： US MA Beverly
- 专利权人： Axcelis Technologies, Inc.
- 当前专利权人： Axcelis Technologies, Inc.
- 当前专利权人地址： US MA Beverly
- 代理机构： Eschweiler & Associates, LLC
- 主分类号： H01L21/683
- IPC分类号： H01L21/683
摘要：
An electrostatic chuck and method for clamping and de-clamping a workpiece is provided. The ESC comprises a clamping plate having a clamping surface, and one or more electrodes. An electric potential applied to the one or more electrodes selectively clamps the workpiece to the clamping surface. An arc pin operably coupled to the clamping plate and a power source provides an arc for penetrating an insulating layer of the workpiece. The arc pin is selectively connected to an electrical ground, wherein upon removal of the insulative layer of the workpiece, the arc pin provides an electrical ground connection to the workpiece.
公开/授权文献
- US20100110603A1 WAFER GROUNDING METHOD FOR ELECTROSTATIC CLAMPS 公开/授权日：2010-05-06
信息查询
IPC分类:
