Invention Grant
US07955065B2 Resin filling apparatus, filling method, and method of manufacturing an electronic device
失效
树脂填充装置，填充方法以及电子装置的制造方法
- Patent Title: Resin filling apparatus, filling method, and method of manufacturing an electronic device
- Patent Title (中): 树脂填充装置，填充方法以及电子装置的制造方法
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Application No.: US12020013Application Date: 2008-01-25
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Publication No.: US07955065B2Publication Date: 2011-06-07
- Inventor: Shuichi Takeuchi
- Applicant: Shuichi Takeuchi
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2007-054074 20070305
- Main IPC: H01L21/56
- IPC: H01L21/56
Abstract:
A resin filling apparatus, a filling method, and a method of manufacturing an electronic device fill a cavity between a substrate and an electronic component mounted on the substrate with resin. The resin filling apparatus includes a stage for supporting the substrate in an inclined state, and an application head for filling the cavity with resin from a lower side of the inclined substrate.
Public/Granted literature
- US20080216917A1 RESIN FILLING APPARATUS, FILLING METHOD, AND METHOD OF MANUFACTURING AN ELECTRONIC DEVICE Public/Granted day:2008-09-11
Information query
IPC分类:
