An electrical connector for electrically coupling an electronic module and an electrical component. The connector includes a substrate that has first and second surfaces separated by a thickness. The substrate includes interconnects that extend through the substrate and are arranged in an array. The interconnects are configured to engage the module along the first surface and engage the electrical component along the second surface. The connector also includes alignment members that extend through openings in the substrate. The alignment members include heads that project beyond and away from the first surface. The heads are located about the substrate relative to each other to collectively form a module reception area therebetween to hold the module in a predetermined position and orientation with respect to the first surface and with respect to the interconnects.