Invention Grant
- Patent Title: Compound body and a process for the production of a mechanical connection
- Patent Title (中): 复合体和生产机械连接的过程
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Application No.: US12704112Application Date: 2010-02-11
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Publication No.: US07955153B2Publication Date: 2011-06-07
- Inventor: Ingo Dunisch
- Applicant: Ingo Dunisch
- Applicant Address: DE Wiesbaden
- Assignee: Xenon Technologies (Germany) GmbH
- Current Assignee: Xenon Technologies (Germany) GmbH
- Current Assignee Address: DE Wiesbaden
- Agency: Wood, Herron & Evans, LLP
- Priority: DE10257477 20021209
- Main IPC: H01J9/00
- IPC: H01J9/00
Abstract:
A compound body has a first body part (15) made of glass and a mechanical connection (20, 60) which is melted on the first body part (15) and contains aluminum.
Public/Granted literature
- US20100136872A1 Compound Body and a Process for the Production of a Mechanical Connection Public/Granted day:2010-06-03
Information query
