发明授权
- 专利标题： Low temperature bonding material comprising metal particles and bonding method
- 专利标题（中）： 包含金属颗粒的低温粘合材料和粘合方法
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申请号： US11964827申请日： 2007-12-27
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公开(公告)号： US07955411B2公开(公告)日： 2011-06-07
- 发明人: Yusuke Yasuda , Toshiaki Morita , Eiichi Ide , Hiroshi Hozoji , Toshiaki Ishii
- 申请人： Yusuke Yasuda , Toshiaki Morita , Eiichi Ide , Hiroshi Hozoji , Toshiaki Ishii
- 申请人地址： JP Tokyo
- 专利权人： Hitachi, Ltd.
- 当前专利权人： Hitachi, Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Antonelli, Terry, Stout & Kraus, LLP.
- 优先权： JP2006-353649 20061228
- 主分类号： B32B5/16
- IPC分类号： B32B5/16 ; B22F1/02
摘要：
A bonding material comprising metal particles coated with an organic substance having carbon atoms of 2 to 8, wherein the metal particles comprises first portion of 100 nm or less, and a second portion larger than 100 nm but not larger than 100 μm, each of the portions having at least peak of a particle distribution, based on a volumetric base. The disclosure is further concerned with a bonding method using the bonding material.
公开/授权文献
- US20080173398A1 LOW TEMPERATURE BONDING MATERIAL AND BONDING METHOD 公开/授权日：2008-07-24