发明授权
- 专利标题： Probe card, semiconductor inspecting apparatus, and manufacturing method of semiconductor device
- 专利标题（中）： 探针卡，半导体检查装置以及半导体装置的制造方法
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申请号： US12143448申请日： 2008-06-20
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公开(公告)号： US07956627B2公开(公告)日： 2011-06-07
- 发明人: Susumu Kasukabe , Naoki Okamoto
- 申请人： Susumu Kasukabe , Naoki Okamoto
- 申请人地址： JP Kanagawa
- 专利权人： Renesas Electronics Corporation
- 当前专利权人： Renesas Electronics Corporation
- 当前专利权人地址： JP Kanagawa
- 代理机构： Mattingly & Malur, P.C.
- 优先权： JP2007-205953 20070807
- 主分类号： G01R31/00
- IPC分类号： G01R31/00
摘要：
A frame bonded and fixed to a back face of a probe sheet so as to surround a group of pyramid-shaped or truncated pyramid-shaped contact terminals collectively formed at a central region portion of the probe sheet on a probing side thereof is protruded from a multi-layered wiring board, and pressing force is imparted to the frame and a pressing piece at a central portion by a plurality of guide pins having spring property so as to tilt finely.
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