Invention Grant
- Patent Title: Method for providing an armature housing
- Patent Title (中): 提供电枢外壳的方法
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Application No.: US12370212Application Date: 2009-02-12
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Publication No.: US07958764B2Publication Date: 2011-06-14
- Inventor: Shreyas R. Mehta , Hassan Chelura Iyenger Parthasarathy , Narayanan Jayasankar
- Applicant: Shreyas R. Mehta , Hassan Chelura Iyenger Parthasarathy , Narayanan Jayasankar
- Applicant Address: US NY White Plains
- Assignee: Indimet Inc.
- Current Assignee: Indimet Inc.
- Current Assignee Address: US NY White Plains
- Agency: IP Attorneys Group, LLC
- Main IPC: B21C23/00
- IPC: B21C23/00 ; B21C1/00

Abstract:
The invention relates to a method of providing an armature housing having the steps of providing a solid cylinder of malleable material having a first part and a second part; raising at least a part of a perimeter of the first part in a direction away from the second part for defining a raised wall; compressing the second part in an axial direction toward the first part, resulting in a flattened disc generally perpendicular to the first part; and wherein the first part, second part, and at least part of the perimeter are all integrally connected as a single piece.
Public/Granted literature
- US20090205393A1 Method For Providing an Armature Housing Public/Granted day:2009-08-20
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