Invention Grant
- Patent Title: Adhesive film for stacking semiconductor chips
- Patent Title (中): 用于堆叠半导体芯片的粘合膜
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Application No.: US11950470Application Date: 2007-12-05
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Publication No.: US07960023B2Publication Date: 2011-06-14
- Inventor: Chang-Hoon Sim , Ki-Jeong Moon , Hae-Sang Jun , Jun-Ho Lee , Yun-Min Park
- Applicant: Chang-Hoon Sim , Ki-Jeong Moon , Hae-Sang Jun , Jun-Ho Lee , Yun-Min Park
- Applicant Address: KR Gumi-Si
- Assignee: Toray Advanced Materials Korea Inc.
- Current Assignee: Toray Advanced Materials Korea Inc.
- Current Assignee Address: KR Gumi-Si
- Agency: Harness, Dickey & Pierce, P.L.C.
- Agent Anthony G. Fussner; Kisuk Lee
- Priority: KR10-2007-0024620 20070313
- Main IPC: B32B7/12
- IPC: B32B7/12 ; B32B7/00
Abstract:
There is provided an adhesive film for stacking semiconductor layers of chips comprising: a first adhesive layer comprising phenoxy resin, epoxy resin and phenol resin; a second adhesive layer comprising phenoxy resin and an ultraviolet ray curable compound; and a third adhesive layer comprising phenoxy resin, epoxy resin and phenol resin, wherein the second adhesive layer is disposed between the first adhesive layer and the third adhesive layer.
Public/Granted literature
- US20080226884A1 ADHESIVE FILM FOR STACKING SEMICONDUCTOR CHIPS Public/Granted day:2008-09-18
Information query
