发明授权
- 专利标题： Adhesive film for stacking semiconductor chips
- 专利标题（中）： 用于堆叠半导体芯片的粘合膜
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申请号： US11950470申请日： 2007-12-05
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公开(公告)号： US07960023B2公开(公告)日： 2011-06-14
- 发明人: Chang-Hoon Sim , Ki-Jeong Moon , Hae-Sang Jun , Jun-Ho Lee , Yun-Min Park
- 申请人： Chang-Hoon Sim , Ki-Jeong Moon , Hae-Sang Jun , Jun-Ho Lee , Yun-Min Park
- 申请人地址： KR Gumi-Si
- 专利权人： Toray Advanced Materials Korea Inc.
- 当前专利权人： Toray Advanced Materials Korea Inc.
- 当前专利权人地址： KR Gumi-Si
- 代理机构： Harness, Dickey & Pierce, P.L.C.
- 代理商 Anthony G. Fussner; Kisuk Lee
- 优先权： KR10-2007-0024620 20070313
- 主分类号： B32B7/12
- IPC分类号： B32B7/12 ; B32B7/00
摘要：
There is provided an adhesive film for stacking semiconductor layers of chips comprising: a first adhesive layer comprising phenoxy resin, epoxy resin and phenol resin; a second adhesive layer comprising phenoxy resin and an ultraviolet ray curable compound; and a third adhesive layer comprising phenoxy resin, epoxy resin and phenol resin, wherein the second adhesive layer is disposed between the first adhesive layer and the third adhesive layer.
公开/授权文献
- US20080226884A1 ADHESIVE FILM FOR STACKING SEMICONDUCTOR CHIPS 公开/授权日：2008-09-18