发明授权
- 专利标题： Holding/convey jig and holding/convey method
- 专利标题（中）： 握持/传送夹具和保持/传送方法
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申请号： US10532949申请日： 2003-07-15
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公开(公告)号： US07963029B2公开(公告)日： 2011-06-21
- 发明人: Atsushi Ishikawa , Osamu Deguchi , Katsuyoshi Kameyama , Makoto Nagaoka , Akihiro Kimura
- 申请人： Atsushi Ishikawa , Osamu Deguchi , Katsuyoshi Kameyama , Makoto Nagaoka , Akihiro Kimura
- 申请人地址： JP Tokyo
- 专利权人： Daisho Denshi Co., Ltd.
- 当前专利权人： Daisho Denshi Co., Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Holtz, Holtz, Goodman & Chick, PC
- 优先权： JPP2002-319823 20021101
- 国际申请： PCT/JP03/08978 WO 20030715
- 国际公布： WO2004/040953 WO 20040513
- 主分类号： H05K3/36
- IPC分类号： H05K3/36
摘要：
A jig for holding and conveyance includes a plate having a weak-adherence adhesive pattern on a surface and a printed circuit board having a conductive portion and a non-conductive portion on the surface of an insulating substrate. The weak-adherence adhesive pattern is formed at a position corresponding to the non-conductive portion. Alternatively, the weak-adherence adhesive pattern subjected to surface roughening is formed on a surface of the weak-adhesive layer at a position corresponding to the conductive portion.
公开/授权文献
- US20060112543A1 Holding/convey jig and holding/convey method 公开/授权日：2006-06-01
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