发明授权
- 专利标题： Method for connecting electronic components, method for forming bump and conductive connection film and fabrication apparatus for electronic component mounted body, bump and conductive connection film
- 专利标题（中）： 电子部件连接方法，凸点形成方法及导电连接薄膜及电子部件安装体，凸块及导电连接薄膜的制造装置
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申请号： US12940803申请日： 2010-11-05
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公开(公告)号： US07963310B2公开(公告)日： 2011-06-21
- 发明人: Tsukasa Shiraishi , Seiichi Nakatani
- 申请人： Tsukasa Shiraishi , Seiichi Nakatani
- 申请人地址： JP Osaka
- 专利权人： Panasonic Corporation
- 当前专利权人： Panasonic Corporation
- 当前专利权人地址： JP Osaka
- 代理机构： McDermott Will & Emery LLP
- 优先权： JP2006-115248 20060419
- 主分类号： B32B37/00
- IPC分类号： B32B37/00
摘要：
A liquid resin in which conductive particles are dispersed is supplied to between a circuit substrate and a semiconductor chip disposed so as to face each other and an ultrasonic wave having an amplitude in a perpendicular direction to a surface of the circuit substrate to generate a standing wave in a resin. Then, the conductive particles dispersed in the resin are captured at nodes of the standing wave to form connection bodies of aggregation of the conductive particles between connection terminals of the semiconductor chip and terminals of the circuit substrate. Thus, the semiconductor chip is mounted on the circuit substrate via the connection bodies. The terminals are arrayed so as to be spaced apart from one another by half a wavelength of the standing wave and each of the nodes of the standing wave are generated at a position between the terminals in the resin.