发明授权
- 专利标题： Heater cartridge and molding apparatus having the same
- 专利标题（中）： 加热器盒及其成型装置
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申请号： US11583733申请日： 2006-10-20
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公开(公告)号： US07963760B2公开(公告)日： 2011-06-21
- 发明人: Jin-hyun Cho , Jong-won Lee
- 申请人： Jin-hyun Cho , Jong-won Lee
- 申请人地址： KR Suwon-si
- 专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人地址： KR Suwon-si
- 代理机构： Roylance, Abrams, Berdo & Goodman L.L.P.
- 优先权： KR10-2005-0100331 20051024; KR10-2005-0110637 20051118; KR10-2005-0111362 20051121
- 主分类号： B29C35/00
- IPC分类号： B29C35/00 ; B29C45/00 ; H05B3/06
摘要：
A heater cartridge and a molding apparatus using the heater cartridge are provided. The molding apparatus includes a mold comprising at least one cartridge channel and a heater cartridge inserted to the cartridge channel, the heater cartridge comprising a main body casing, a plurality of heating sectors dividing an inside of the main body casing, and a heating part provided to at least one of the heating sectors to heat a predetermined area of the mold. The heater cartridge and molding apparatus having same provide uniform heating to enhance thermal efficiency and the quality of a product.
公开/授权文献
- US20070089473A1 Heater cartridge and molding apparatus having the same 公开/授权日：2007-04-26
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