Invention Grant
- Patent Title: Heater cartridge and molding apparatus having the same
- Patent Title (中): 加热器盒及其成型装置
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Application No.: US11583733Application Date: 2006-10-20
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Publication No.: US07963760B2Publication Date: 2011-06-21
- Inventor: Jin-hyun Cho , Jong-won Lee
- Applicant: Jin-hyun Cho , Jong-won Lee
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Roylance, Abrams, Berdo & Goodman L.L.P.
- Priority: KR10-2005-0100331 20051024; KR10-2005-0110637 20051118; KR10-2005-0111362 20051121
- Main IPC: B29C35/00
- IPC: B29C35/00 ; B29C45/00 ; H05B3/06
Abstract:
A heater cartridge and a molding apparatus using the heater cartridge are provided. The molding apparatus includes a mold comprising at least one cartridge channel and a heater cartridge inserted to the cartridge channel, the heater cartridge comprising a main body casing, a plurality of heating sectors dividing an inside of the main body casing, and a heating part provided to at least one of the heating sectors to heat a predetermined area of the mold. The heater cartridge and molding apparatus having same provide uniform heating to enhance thermal efficiency and the quality of a product.
Public/Granted literature
- US20070089473A1 Heater cartridge and molding apparatus having the same Public/Granted day:2007-04-26
Information query
