发明授权
US07964289B2 Formation method of metal layer on resin layer, printed wiring board, and production method thereof
有权
树脂层上的金属层的形成方法，印刷电路板及其制造方法
- 专利标题： Formation method of metal layer on resin layer, printed wiring board, and production method thereof
- 专利标题（中）： 树脂层上的金属层的形成方法，印刷电路板及其制造方法
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申请号： US12614267申请日： 2009-11-06
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公开(公告)号： US07964289B2公开(公告)日： 2011-06-21
- 发明人: Kenji Takai , Norio Moriike , Kenichi Kamiyama , Katsuyuki Masuda , Kiyoshi Hasegawa
- 申请人： Kenji Takai , Norio Moriike , Kenichi Kamiyama , Katsuyuki Masuda , Kiyoshi Hasegawa
- 申请人地址： JP Tokyo
- 专利权人： Hitachi Chemical Company, Ltd.
- 当前专利权人： Hitachi Chemical Company, Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Antonelli, Terry, Stout & Kraus, LLP.
- 优先权： JPP2003-385852 20031114; JPP2003-385853 20031114; JPP2004-018139 20040127; JPP2004-024400 20040130; JPP2004-024422 20040130
- 主分类号： B32B3/00
- IPC分类号： B32B3/00
摘要：
A printed wiring board having a conductor circuit comprising a copper layer adjacent to an insulating layer and an electroless gold plating, wherein the insulating layer has ten-point mean surface roughness (Rz) of 2.0 μm or less is provided. According to the present invention, there is no such a defect that gold plating is deposited on a resin, and fine wiring formation with accuracy is realized.
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