发明授权
US07964671B2 Thermally curable composite resin composition, prepreg, composite film and laminated material for circuit having the same
有权
热固性复合树脂组合物，预浸料，复合膜和具有该热固性复合树脂组合物的电路用叠层材料
- 专利标题： Thermally curable composite resin composition, prepreg, composite film and laminated material for circuit having the same
- 专利标题（中）： 热固性复合树脂组合物，预浸料，复合膜和具有该热固性复合树脂组合物的电路用叠层材料
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申请号： US11857034申请日： 2007-09-18
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公开(公告)号： US07964671B2公开(公告)日： 2011-06-21
- 发明人: Myong Jae Yoo , Woo Sung Lee , Seong Dae Park , Se Hoon Park
- 申请人： Myong Jae Yoo , Woo Sung Lee , Seong Dae Park , Se Hoon Park
- 申请人地址： KR Gyeonggi-do
- 专利权人： Korea Electronics Technology Institute
- 当前专利权人： Korea Electronics Technology Institute
- 当前专利权人地址： KR Gyeonggi-do
- 代理机构： Lee, Hong, Degerman, Kang & Waimey
- 优先权： KR10-2007-0068313 20070706
- 主分类号： C08K5/15
- IPC分类号： C08K5/15 ; C08F36/00 ; C08F8/00
摘要：
The present invention relates to a prepreg, a composite film, and a laminated material for circuit used for thermosetting composite resin compositions and printed circuit boards, and particularly to a thermosetting composite resin composition mixed with COP (Cyclo Olefin Polymer) and thermally cross-linkable resin, wherein the COP having excellent electrical characteristics at a high frequency and thermally cross-linkable resin are blended to allow having a less dielectric constant and a less dielectric loss than those of the conventional composite resin composition, and inorganic fillers such as ceramic material, metal material, carbon black are added to allow having dielectric characteristics covering from a low dielectric constant to a high dielectric constant.
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