发明授权
- 专利标题: Ion implanting apparatus
- 专利标题(中): 离子注入装置
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申请号: US12294674申请日: 2007-03-27
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公开(公告)号: US07964856B2公开(公告)日: 2011-06-21
- 发明人: Ichiro Nakamoto , Hiroshi Horai , Tatsuya Sodekoda , Masahiro Yoshida
- 申请人: Ichiro Nakamoto , Hiroshi Horai , Tatsuya Sodekoda , Masahiro Yoshida
- 申请人地址: JP Tokyo
- 专利权人: IHI Corporation
- 当前专利权人: IHI Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: Griffin & Szipl, P.C.
- 优先权: JP2006-099477 20060331
- 国际申请: PCT/JP2007/056474 WO 20070327
- 国际公布: WO2007/114120 WO 20071011
- 主分类号: G21K5/10
- IPC分类号: G21K5/10
摘要:
In an ion implanting apparatus 10 including a separation slit 20 which receives an ion beam 1 having passed through a mass-separation electromagnet 17 and allows a desired type of ion to selectively pass therethrough, the separation slit 20 is operable to vary a shape of a gap through which the ion beam 1 passes. In addition, the ion implanting apparatus 10 includes a variable slit 30 which is disposed between an extraction electrode system 15 and the mass-separation electromagnet 17 so as to form a gap through which the ion beam 1 passes and is operable to vary a shape of the gap so as to shield a part of the ion beam 1 extracted from the ion source 12. The ion implanting apparatus 10 may include both or one of the separation slit 20 and the variable slit 30.
公开/授权文献
- US20100171048A1 ION IMPLANTING APPARATUS 公开/授权日:2010-07-08
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