Invention Grant
- Patent Title: Over-current and over-voltage protection assembly apparatus
- Patent Title (中): 过电流和过电压保护装置
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Application No.: US11857839Application Date: 2007-09-19
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Publication No.: US07965479B2Publication Date: 2011-06-21
- Inventor: Pao Hsuan Chen , Ching Han Yu , Tong Cheng Tsai
- Applicant: Pao Hsuan Chen , Ching Han Yu , Tong Cheng Tsai
- Applicant Address: TW
- Assignee: Polytronics Technology Corporation
- Current Assignee: Polytronics Technology Corporation
- Current Assignee Address: TW
- Agency: Seyfarth Shaw LLP
- Priority: TW95219286U 20061101
- Main IPC: H02H3/00
- IPC: H02H3/00

Abstract:
An over-current and over-voltage protection assembly apparatus including an over-current protection (OCP) device and an over-voltage protection (OVP) device is provided. One end of the OCP device is electrically connected to a first connection point, and the other end is electrically connected to a second connection point. One end of the OVP device is electrically connected to a third connection point, and the other end is electrically connected to the second connection point. The second connection point is a common point. The OCP device and the OVP device are modularized and integrated to an assembly. The first, second, and third connection points are connected to an external circuit to be protected, such that the OCP device is connected in series to the circuit to be protected, and the OVP device is connected in parallel to the circuit to be protected.
Public/Granted literature
- US20080100981A1 OVER-CURRENT AND OVER-VOLTAGE PROTECTION ASSEMBLY APPARATUS Public/Granted day:2008-05-01
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