An electrical connector assembly for establishing electrical connection between an Integrated Package (IC) and a Printed Circuit Board (PCB) is provided. The electrical connector assembly comprises an insulative housing, a plurality of contacts received in the insulative housing, a PCB adapted to have the insulative housing mounted thereon and a metal reinforcement element disposed on a lower surface of the housing and soldered to the PCB. By way abovementioned, a back plate may be canceled and space under the PCB is saved under a condition that steady mechanical connection between the PCB and the housing is achieved.