A plug connector having a plug body including a board substrate. The board substrate has at least one engagement surface that is configured to interface with mating contacts of a receptacle connector. The plug connector also includes a plurality of differential pairs that extend along the board substrate. The differential pairs include conductive pathways that have contact pads located on said at least one engagement surface. The contact pads are configured to electrically engage the mating contacts of the receptacle connector. The conductive pathways of at least one differential pair form a cross-over such that the conductive pathways of the plurality of differential pairs have a first arrangement with respect to each other before the cross-over and a different second arrangement after the cross-over. The first and second arrangements generate first and second crosstalk components, respectively, that are configured to offset one another.