发明授权
- 专利标题: Methods of transferring a lamina to a receiver element
- 专利标题(中): 将层转移到接收器元件的方法
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申请号: US12335479申请日: 2008-12-15
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公开(公告)号: US07967936B2公开(公告)日: 2011-06-28
- 发明人: Aditya Agarwal , Srinivasan Sivaram , Michael Vyvoda
- 申请人: Aditya Agarwal , Srinivasan Sivaram , Michael Vyvoda
- 申请人地址: US CA San Jose
- 专利权人: Twin Creeks Technologies, Inc.
- 当前专利权人: Twin Creeks Technologies, Inc.
- 当前专利权人地址: US CA San Jose
- 代理机构: The Mueller Law Office, P.C.
- 主分类号: B29C65/16
- IPC分类号: B29C65/16 ; B32B37/02 ; B32B37/06 ; B32B37/14 ; B32B38/10 ; H01L21/302 ; B29C65/56 ; B32B37/10 ; B32B37/15 ; H01L21/304
摘要:
Methods for bonding a donor wafer to a receiver element and transferring a lamina from the donor wafer to the receiver element are disclosed herein. The donor wafer may be, for example, a monocrystalline silicon wafer with a thickness of from about 300 microns to about 1000 microns, and the lamina may be may be less than 100 microns thick. The receiver element may be composed of, for example, metal or glass, and the receiver element may have dissimilar thermal expansion properties from the lamina. Although the lamina and the receiver element may have dissimilar thermal expansion properties, the methods disclosed herein maintain the integrity of the bond between the lamina and the receiver element.
公开/授权文献
- US20100147448A1 METHODS OF TRANSFERRING A LAMINA TO A RECEIVER ELEMENT 公开/授权日:2010-06-17