发明授权
- 专利标题： Package having a plurality of mounting orientations
- 专利标题（中）： 具有多个安装方向的包装
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申请号： US11780894申请日： 2007-07-20
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公开(公告)号： US07968807B2公开(公告)日： 2011-06-28
- 发明人: Timothy R. Spooner , Nelson Kuan
- 申请人： Timothy R. Spooner , Nelson Kuan
- 申请人地址： US MA Norwood
- 专利权人： Analog Devices, Inc.
- 当前专利权人： Analog Devices, Inc.
- 当前专利权人地址： US MA Norwood
- 代理机构： Sunstein Kann Murphy & Timbers LLP
- 主分类号： H01L23/495
- IPC分类号： H01L23/495
摘要：
A package apparatus has a base coupled with a lid to form a leadframe package. The package has first and second exterior surfaces with respective first and second contact patterns. The first and second contact patterns are substantially electrically identical to permit the package to be either vertically or horizontally mounted to an underlying apparatus.
公开/授权文献
- US20080205025A1 Package Having a Plurality of Mounting Orientations 公开/授权日：2008-08-28
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