发明授权
- 专利标题: Loop type micro heat transport device
- 专利标题(中): 环型微型热输送装置
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申请号: US11577233申请日: 2005-12-09
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公开(公告)号: US07971633B2公开(公告)日: 2011-07-05
- 发明人: Seok Hwan Moon , Gunn Hwang , Sung Weon Kang , Chang Auck Choi
- 申请人: Seok Hwan Moon , Gunn Hwang , Sung Weon Kang , Chang Auck Choi
- 申请人地址: KR Daejeon
- 专利权人: Electronics and Telecommunications Research Institute
- 当前专利权人: Electronics and Telecommunications Research Institute
- 当前专利权人地址: KR Daejeon
- 代理机构: Rabin & Berdo, P.C.
- 优先权: KR10-2004-0104284 20041210; KR10-2005-0043467 20050524
- 国际申请: PCT/KR2005/004209 WO 20051209
- 国际公布: WO2006/062371 WO 20060615
- 主分类号: H05K7/20
- IPC分类号: H05K7/20
摘要:
Provided is a loop type micro heat transport device including: a lower plate having a reservoir for storing operating fluid at its upper surface, an evaporating part spaced apart from the reservoir to evaporate the operating fluid, and a condensing part for condensing vapor evaporated from the evaporating part; and an upper plate engaged with an upper surface of the lower plate and formed at a position corresponding to the evaporating part and the condensing part, and including a vapor space having a vapor line through which the vapor evaporated from the evaporating part is transported to the condensing part, wherein the operating fluid is circulated through the reservoir, the evaporating part, and the condensing part. Therefore, it is possible to remarkably improve productivity since its simple structure helps to make the manufacture simple, as well as to improve cooling performance and enabling long distance heat transport.
公开/授权文献
- US20070256814A1 Loop Type Micro Heat Transport Device 公开/授权日:2007-11-08