Invention Grant
- Patent Title: Method for separating dross in soldering process
- Patent Title (中): 在焊接过程中分离浮渣的方法
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Application No.: US12688369Application Date: 2010-01-15
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Publication No.: US07972411B2Publication Date: 2011-07-05
- Inventor: Ching-Feng Hsieh
- Applicant: Ching-Feng Hsieh
- Applicant Address: TW Taipei
- Assignee: Askey Computer Corporation
- Current Assignee: Askey Computer Corporation
- Current Assignee Address: TW Taipei
- Agency: Edwards Angell Palmer & Dodge LLP
- Agent Peter F. Corless; Steven M. Jensen
- Priority: TW98141821A 20091208
- Main IPC: B01D43/00
- IPC: B01D43/00

Abstract:
Proposed is a method for separating dross in a soldering process for a printed circuit board using a tin bath containing liquid tin. The method includes collecting dross produced during the soldering process; grinding the dross to tin ash in the tin bath for allowing a portion of tin contained in the tin ash to be melted again to join the liquid tin; and scooping up and recycling the tin ash not melted in the tin liquid. The method precludes a waste of tin resources and high manufacturing costs which might otherwise arise from directly scooping up dross of high tin content.
Public/Granted literature
- US20110132145A1 METHOD FOR SEPARATING DROSS IN SOLDERING PROCESS Public/Granted day:2011-06-09
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