发明授权
- 专利标题: Electro-magnetic bandgap structure
- 专利标题(中): 电磁带隙结构
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申请号: US12437341申请日: 2009-05-07
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公开(公告)号: US07973619B2公开(公告)日: 2011-07-05
- 发明人: Won-Woo Cho , Dek-Gin Yang , Bong-Wan Koo , Hyung-Ho Kim
- 申请人: Won-Woo Cho , Dek-Gin Yang , Bong-Wan Koo , Hyung-Ho Kim
- 申请人地址: KR Gyunggi-do
- 专利权人: Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人: Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址: KR Gyunggi-do
- 代理机构: McDermott Will & Emery LLP
- 优先权: KR10-2008-0098617 20081008
- 主分类号: H01P1/203
- IPC分类号: H01P1/203 ; H01P5/08
摘要:
An electro-magnetic bandgap structure is disclosed. The electro-magnetic bandgap structure in accordance with an embodiment of the present invention includes a plurality of conductive plates bridge-connected with one another on a same plane, whereas the each of the conductive plates includes an internal patch; a first ring patch be electrically separated from the internal patch and surrounding the internal patch; and a second ring patch surrounding the first ring patch and electrically connected with the first ring patch through a portion.
公开/授权文献
- US20100085128A1 ELECTRO-MAGNETIC BANDGAP STRUCTURE 公开/授权日:2010-04-08
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